chip bonding

基本解释

In thermosonic chip bonding process, the impedance of PZT transducer is a very important parameter.
在热超声芯片键合过程中，PZT换能器阻抗是键合系统的一个重要的研究参数。
To be an advancing technology in capsulation, there is a well developing foreground for the thermosonic flip-chip bonding.
热超声倒装键合作为前沿封装技术具有良好的发展前景。
This paper introduces the forward trends of flip chip bonding, the essential kinds of bumps, fabrication technology and testing technology about qualities.
介绍了芯片倒装焊的重要意义、发展趋势、基本的焊球类型、制作方法及焊球质量的检测技术。

This circuitry will allow the microprocessor maker to replace the delicate bonding wires connecting the chip to the package with tiny balls of solder.
FORBES: It's all in the packaging