thermosonic

常见例句

The dynamic optimum design of high-frequency ultrasonic transducer was studied to improve thermosonic packaging efficiency and reduce packaging temperature.
为提高热超声封装效率、降低封装温度,研究了高频超声换能器的动力学优化设计。
The thermosonic flip chip bonding has been realized under the pressure constrain pattern of flip chip. Fragment of pad,circle band and ridge have been observed on the bonding interface.
采用压力约束模式夹持倒装芯片,实现了热超声倒装键合,观察到环状的键合界面微观形貌,脊状撕裂棱以及表皮层碎片。
Schwizer, J., et al., 1999, ”Thermosonic ball bonding: Friction model based on integrated microsensor measurements,” Electronics Manufacturing Technology Symposium, 24th IEEE / CPMT, pp.108-114.
陈津佑，2000，电子构装热超音波焊线制程之介面能量理论模式的建立及其应用，国立中正大学机械工程研究所，硕士论文。
Thermosonic Flip Chip Bongding for Power LED Chips
功率型LED芯片的热超声倒装技术
Formation of circle band interface of thermosonic flip chip bonding
热超声倒装键合环状界面的形成
Present Development of Thermosonic Flip - chip Bonding Process
芯片封装互连新工艺热超声倒装焊的发展现状