thermal impedance

基本解释

Using a same semiconductor laser scheme, the thermal impedance of diamond thermal management is only 40% of A1N thermal management.
采用完全相同的半导体激光器结构金刚石膜热沉的热阻仅为氮化铝热沉的40％。
Using a same semiconductor laser scheme, the thermal impedance of diamond thermal management is only 40% of AlN thermal management.
采用完全相同的半导体激光器结构，金刚石膜热沉的热阻仅为氮化铝热沉的4 0 % 。
The effect of dielectric constant, dielectric loss factor, coefficient of thermal expansion (CTE)and characteristic impedance of substrate materials on properties of MMB are mainly discussed.
介绍了微波多层板所用基材的性能参数，重点阐述了材料的介电常数、介质损耗、热胀系数、特性阻抗对多层板性能的影响。