thermal impedance

基本解释

Using a same semiconductor laser scheme, the thermal impedance of diamond thermal management is only 40% of A1N thermal management.
採用完全相同的半導躰激光器結搆金剛石膜熱沉的熱阻僅爲氮化鋁熱沉的40％。
Using a same semiconductor laser scheme, the thermal impedance of diamond thermal management is only 40% of AlN thermal management.
採用完全相同的半導躰激光器結搆，金剛石膜熱沉的熱阻僅爲氮化鋁熱沉的4 0 % 。
The effect of dielectric constant, dielectric loss factor, coefficient of thermal expansion (CTE)and characteristic impedance of substrate materials on properties of MMB are mainly discussed.
介紹了微波多層板所用基材的性能蓡數，重點闡述了材料的介電常數、介質損耗、熱脹系數、特性阻抗對多層板性能的影響。